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        四層沉鎳金板 -meiG 美格


        通信產品 Munications products
        產品介紹  product character:
        1、四層沉鎳金板 4 LATERS BOARD  IMM.GOLD
        2、過孔半塞孔(單面阻焊開窗)要求塞孔飽滿度達到60%以上 60%SOLDER MASK TENDING 

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